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Fly tail soft hard combination
Number of layers 8th floor
FPC layers 6th floor
Plate thickness 1.6MM- 10%
Minimum aperture 0.15MM
Copper hole thickness 20-25UM
Surface Treatment Chemical gold 2-3 miles
Impedance 85Q- 10%
Warpage ≤0.075MM
Tolerance accuracy ±0.05MM
application area industrial control equipment
Soft hard combination HDI
Number of layers 6L
Line width and spacing 0.075/0.1MM
Plate thickness 0.45- 0.03MM
Minimum aperture 0.1MM
Copper hole thickness 20-25UM
Surface Treatment 2 miles of gold
Ink thickness 12-15UM
material Panasonic/DuPont/Taihong
Licensed process Laser drilling/electroplating filling
application area UAV
Class carrier board
Number of layers 2L
Line width and spacing 0.05/0.075MM
Plate thickness 0.25- 0.03MM
Minimum aperture 0.1MM
Copper hole thickness 12-15UM
Surface Treatment Nickel palladium 4 miles
Ink thickness 25-28UM
material BT material
Licensed process Grinding and leveling/dry film solder mask
application area Carrier board
Car gear handball
Circuit board type Soft hard combination
Number of layers 4th floor
Line width and spacing 0.12MM/0.1MM
Plate thickness 1.2MM
Minimum aperture 0.2MM
Copper hole thickness 20-25UM
Surface Treatment Chemical gold 2-3 miles
Ink thickness 12-15UM
material Shengyi/Taihong
Testing items Four wire test/conductivity test
application area Car gear shifter
5G high-frequency and high-speed
Number of layers 6th floor
Line width and spacing 0.075MM/0.075MM
Plate thickness 0.23MM
Minimum aperture 0.1MM
DK 2.5/DF: 0.0017
dielectric loss angle 0.003
dielectric constant 3.4
Impedance 100Q- 10%
material Panasonic/DuPont
Tolerance accuracy ±0.05MM
application area 5G communication
Multi layer high-precision FPC
Number of layers 8th floor
Line width and spacing 0.05MM/0.05MM
Plate thickness 0.28MM
Minimum aperture 0.1MM
Copper hole thickness 12-15UM
Surface Treatment Chemical gold 2-3 miles
Impedance 1002- 10%
BGA tray 0.1MM
Tolerance accuracy ±0.05MM
application area Medical imaging equipment